Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
1～7 item / All 7 items
This is a manual CMP device compatible with φ300 wafers. It is ideal for MEMS, TSV, and thin processing.
It is ideal for film processing (CMP) of silicon wafers and thin plate processing. There are devices compatible with Low-K films, conductors, and insulating films. Thin plate processing of wafer materials can also be performed separately with an optional device, allowing for the separation of wafers as thin as 30μm and 50μm.
We can provide consistent production from substrate arrangement to mask design! Introducing the contract processing services of Global Net Co., Ltd., including pattern wafer services!
At Global Net Co., Ltd., we provide services such as GNC processing foundry and GNC patterned wafer services. We mainly offer processing services for silicon wafers, glass, and other materials tailored to our customers' needs. We are capable of providing integrated production from substrate arrangement to mask design. 【Business Overview】 ■ GNC Processing Foundry - Film deposition foundry - Process evaluation ■ GNC Patterned Wafer Services - GNC fine patterned wafers - GNC advanced CMP evaluation patterned wafers - GNC MEMS and silicon special processing services ■ GNC 2.1D/2.5D/3D Solutions - Bump wafer and redistribution processing / FOWLP process services *For more details, please refer to the PDF materials or feel free to contact us.
You can monitor the COF (friction coefficient), pad surface temperature, polishing liquid temperature, and room temperature inside the device.
【Tribo】 - Compatible with 400mm diameter polishing plates - 100mm/4-inch polishing head x2 axes - Two slurry pumps, compatible with acidic slurries - Supports industry-standard In-Situ diamond conditioning - Controlled by a built-in touch panel PC 【Orbis】 - Compatible with 600mm diameter polishing plates - 200mm/8-inch polishing head x2 axes - Two slurry pumps, compatible with acidic slurries *Equipped with two types of slurries - Supports industry-standard In-Situ diamond conditioning - Controlled by a built-in touch panel PC
![[Commissioned CMP] MAT Division](https://image.mono.ipros.com/public/product/image/179/2000593996/IPROS95277814669232404274.png?w=280&h=280)
CMP process development, prototyping, and contract processing! With reliable technical skills and experience, we meet our customers' needs.
We would like to introduce our CMP/Dicing business, "MAT Division." We offer services such as "flattening," "smoothing," and "thinning (thin film)," not only in the semiconductor field but also for SiC power devices, SOI, micro-machines (MEMS), optical devices, LED sapphire, organic EL, and more. With our reliable technical expertise and experience, we respond to our customers' needs in advanced technologies such as "grinding," "lapping," "polishing," "CMP," and "cleaning." 【Features】 ■ CMP process development, prototyping, and contract processing ■ "Flattening," "smoothing," "thinning (thin film)" ■ Not limited to the semiconductor field ■ Responding to customer needs with reliable technical expertise and experience *For more details, please refer to the related link page or feel free to contact us.
![CMP device [Desktop type for research and development, compatible with wafers up to 300mm!]](https://image.mono.ipros.com/public/product/image/941/2000736254/IPROS79608044675729770631.jpeg?w=280&h=280)
We offer a lineup of CMP equipment ranging from tabletop models to those compatible with 300mm wafers! Customization and new designs are possible, including features like Dry-in/Dry-out!
We offer a lineup ranging from compact models suitable for research and development to models compatible with 300mm wafers. We can also propose specification changes, custom orders, and CMP automatic devices that allow for Dry-in / Dry-out according to your needs. We have demo units available, so we can conduct demo tests in your presence. 【We can also accommodate requests such as the following】 ■ Chemical compatibility (capable of handling various acidic and alkaline slurries) ■ Support for abrasive supply systems ■ Desire to include sensors to measure vibrations ■ Wanting to apply higher loads than usual ■ Wanting to measure temperature and humidity inside the device *For more details, please refer to the PDF document or feel free to contact us.
Leave it to us for double-sided grinding machines, polishing machines, and CMP equipment.
We have received high praise from customers in various fields for our grinding, polishing, cutting, and have developed technologies for flying line grinding, wrapping and polishing related equipment, semiconductor-related products, dicing machines, and back grinding machines, providing products with a solid foundation of trust.
Dry in / dry out is possible! Equipment for mirror finishing of silicon wafers.
The "MGP-808XJ" is a fully automatic CMP device that is the successor to the Lap Master SFT's "LGP-808XJ." It adopts a newly developed head by our company, achieving improvements in GBIR and SFQR on the wafer surface. The transport method is either edge clamp or edge contact. Additionally, it allows for dry in/dry out capabilities through integration with a cleaning machine. 【Features】 ■ Successor model to the Lap Master SFT's "LGP-808XJ" ■ Achieves improvements in GBIR and SFQR on the wafer surface ■ High throughput with 8 polishing heads and 3 polishing plates ■ All transport systems use either edge clamp or edge contact methods ■ Allows for dry in/dry out capabilities through integration with a cleaning machine *For more details, please refer to the PDF document or feel free to contact us.
